Aismalibar to attend Productronica November 12 to 15, 2019

As the only exhibition of this kind, productronica showcases the entire value chain in electronics manufacturing – from technologies and components to software and services. Approximately 45,000 professionals attended the conference in 2017 and it continues to grow each year.

After successful participation in the 2017 edition of Productronica, Aismalibar will attend the Munich event and showcase its latest developments in IMS laminates, as well as the new range of automation for production of PCBs of the Technosystem brand.

Aismalibar will be located in productronica Hall B3 with stand 351 (see map). In addition to offering personalized attention to all those who seek information, it will exhibit machinery from the Technosystem catalog, a brand of The Benmayor Group that develops technology and machinery for the production of PCBs. Technosystem will also present its new range of loaders, unloaders and robots for the production of printed circuits.

Aismalibar will also showcase COBRITHERM ULTRATHIN 4W - TG180ºC - 150ºC MOT, an insulated metal substrate (IMS) based on an aluminum cladding with an ED copper sheet on the opposite side, containing an innovative 35m ultra-thin polymer-ceramic dielectric layer of its own formulation, offering industry-leading thermal conductivity and high dielectric strength. It also offers strong MOT, High Tg and Low CTE values, which are the key elements for performance of the MPCB operating at high temperatures.

The Thermal Multilayer product range will also be presented as well as products for the development of multilayer PCBs that can be combined to customize solutions for complex electronic designs and applications. THIN LAM and BOND SHEET can be used in standard multilayer lamination processes to improve resistance to thermal shocks, conductivity and thermal dissipation.

The new THIN LAM and BOND SHEETS of 3.2W have been developed to reduce thermal resistance. A MOT of 150ºC, high Tg values of 180ºC and Low CTE below 1.8% (50 to 250ºC) considerably improve the overall thermal efficiency.