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Last news

6/22/2022

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

5/06/2022

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

4/09/2022

These are the new TIMs for power electronics

Improved Thermal Interface Materials<br>for Cooling High-Power Electronics

3/09/2022

Improved Thermal Interface Materials
for Cooling High-Power Electronics

11/16/2021

Aismalibar’s new range of Thermal Interface Material (TIM).

11/16/2021

AISMALIBAR to exhibit at 2021 Productronica, November 16-19, 2021 in Munich, Germany.

10/01/2021

FR4 Thermal properties to consider when designing PCBs

10/14/2020

Learn how to remove heat from your PCB designs

10/02/2020

Webinar: Lab tests to ensure the quality of IMS Laminates with American Standard Circuits.

9/29/2020

Aismalibar Adds Steven Calvert As Field Applications Engineer

See all news

Archivo de etiquetas: Thermal management

Aismalibar experts in thermal management

Innovative Thermal Management Solutions for High Power Electronic Modules

julio 16, 2021 9:42 am Publicado por webmaster Deja tus comentarios

In this article we propose Aismalibar‘s thermal solutions for high power electronic modules. The current trend in power electronics in... Ver artículo

Thermal FR4 by Aismalibar, the evolution of standard FR4

junio 7, 2021 9:28 am Publicado por webmaster Deja tus comentarios

Thermal FR4 by Aismalibar is a revolutionary FR4 enriched with mineral filler, capable of dissipating the heat more efficiently that a... Ver artículo

Dielectric Film as TIM in Power Electronic Applications

junio 1, 2021 9:55 am Publicado por webmaster Deja tus comentarios

The omnipresent trend in electronics is towards smaller designs with increasing performance requirements. As a consequence , there is the... Ver artículo

BOND SHEET CURED + AIR GAP FILLER

Ultra-thin dielectric layer, high dielectric strength,
high thermal conductivity and low thermal resistance.

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)

70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)

50(1,2)

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)

70(2,8)

80(3,1)

100(3,9)

	Total thickness
Bond Sheet Cured 70µm (ASTM 5476)	70 µm	4 KV	0,041 K/W	2,2 W/mK
Bond Sheet Cured 100µm (ASTM 5476)	100 µm	6 KV	0,058 K/W	2,2 W/mK
Bond Sheet Cured 70µm + Air Gap Filler	120 µm	4,2 KV	0,07 K/W	2,2 W/mK
Bond Sheet Cured 100µm + Air Gap Filler	150 µm	6,2 KV	0,088 K/W	2,2 W/mK
Air gap filler + Bond Sheet Cured 70µm + Air gap filler	170 µm	4,4 KV	0,099 K/W	2,2 W/mK
Air gap filler + Bond Sheet Cured 100µm + Air gap filler	200 µm	6,4 KV	0,117 K/W	2,2 W/mK
Bond Sheet Cured 80µm High Tg (ASTM 5476)	80 µm	4 KV	0,031 K/W	3,2 W/mK
Bond Sheet Cured 80µm High Tg + Air gap filler	130 µm	4,2 KV	0,051 K/W	3,2 W/mK
Air gap filler + Bond Sheet Cured 80µm HTg + Air gap filler	180 µm	4,4 KV	0,070 K/W	3,2 W/mK

Dielectric capacity Thermal resistance Rth Thermal conductivity

Bond sheet cured 70µm (ASTM5476)
Total thickness	70µm
Dialectric capacity	4KV
Thermal resistance Rth	0,041K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm (ASTM 5476)
Total thickness	100µm
Dialectric capacity	6KV
Thermal resistance Rth	0,058K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 70µm + Air gap filler
Total thickness	120µm
Dialectric capacity	4,2KV
Thermal resistance Rth	0,07K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm + Air gap filler
Total thickness	150µm
Dialectric capacity	6,2KV
Thermal resistance Rth	0,88K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 70µm + Air gap filler
Total thickness	170µm
Dialectric capacity	4,4KV
Thermal resistance Rth	0,99K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 100µm + Air gap filler
Total thickness	200µm
Dialectric capacity	6,4KV
Thermal resistance Rth	0,117K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Bond Sheet Cured 80µm High Tg (ASTM 5476)
Total thickness	80µm
Dialectric capacity	4KV
Thermal resistance Rth	0,031K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Bond Sheet Cured 80µm High Tg + Air gap filler
Total thickness	130µm
Dialectric capacity	4,2KV
Thermal resistance Rth	0,051K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 80µm High Tg + Air gap filler
Total thickness	180µm
Dialectric capacity	4,4KV
Thermal resistance Rth	0,070K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Bond sheet cured 70µm (ASTM5476)
Total Thickness	70 µm
Dialectric capacity	4 KV
Thermal resistance Rth	0,041K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm (ASTM5476)
Total Thickness	100 µm
Dialectric capacity	6 KV
Thermal resistance Rth	0,058 K/W
Thermal conductivity	2,2 W/mK
Technical data sheet

Bond Sheet Cured 70µm + Air gap filler
Total Thickness	120 µm
Dialectric capacity	4,2 KV
Thermal resistance Rth	0,07 K/W
Thermal conductivity	2,2 W/mK
Technical data sheet

Bond Sheet Cured 100µm + Air gap filler
Total Thickness	150 µm
Dialectric capacity	6,2 KV
Thermal resistance Rth	0,88 K/W
Thermal conductivity	2,2 W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 70µm + Air gap filler
Total Thickness	170 µm
Dialectric capacity	4,4 KV
Thermal resistance Rth	0,99 K/W
Thermal conductivity	3,2 W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 100µm + Air gap filler
Total Thickness	200 µm
Dialectric capacity	6,4 KV
Thermal resistance Rth	0,117 K/W
Thermal conductivity	3,2 W/mK
Technical data sheet

Bond Sheet Cured 80µm High Tg (ASTM 5476)
Total Thickness	80 µm
Dialectric capacity	4 KV
Thermal resistance Rth	0,031 K/W
Thermal conductivity	3,2 W/mK
Technical data sheet

Bond Sheet Cured 80µm High Tg + Air gap filler
Total Thickness	130 µm
Dialectric capacity	4,2 KV
Thermal resistance Rth	0,051 K/W
Thermal conductivity	3,2 W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 80µm High Tg + Air gap filler
Total Thickness	180 µm
Dialectric capacity	4,4 KV
Thermal resistance Rth	0,070 K/W
Thermal conductivity	3,2 W/mK
Technical data sheet

ALPRIMER (ISOLAL)

Aluminum laminate coated with a thermal conductive ultra-thin dielectric layer.

Insulation thickness µm (in)

100(3,9)

Aluminium thickness um (In)

1000 (0.039)/ 1500 (0.059)/2000(0.078)/3000 (0.12)

	Dielectric capacity (KV)
ALP	6	Technical Data Sheet

BOND SHEET CURED + THERMAL TAPE

Adhesive film with thermal transmission combined with an ultra-thin dielectric layer.

Thermal Tape um (mllc)

50 (1.9)

Dielectric thickness µm (mlic)

70(2,8)/80(3,1) / 100(3,9)

	Total Thickness (µm)	Dielectric capacity (KV)	Thermal Resistance Rth (K/W)	Thermal Conductivity
Bond Sheet Cured 70µm + Thermal Tape	120	4,5	0,09	2,2 W/mk	Technical Data Sheet
Bond Sheet Cured 100µm + Thermal Tape	150	6,5	0,107	2,2 W/mk	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 70µm + Thermal Tape	170	4,7	0,119	2,2 W/mk	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 100µm + Thermal Tape	200	6,7	0,136	2,2 W/mk	Technical Data Sheet
Bond Sheet Cured 80µm High Tg + Thermal Tape	130	4,5	0,08	3,2 W/mK	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 80µm High Tg + Thermal Tape	180	4,7	0,099	3,2 W/mK	Technical Data Sheet

Last news

6/22/2022

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

5/06/2022

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

4/09/2022

These are the new TIMs for power electronics

3/09/2022

Improved Thermal Interface Materials
for Cooling High-Power Electronics

11/16/2021

Aismalibar’s new range of Thermal Interface Material (TIM).

11/16/2021

AISMALIBAR to exhibit at 2021 Productronica, November 16-19, 2021 in Munich, Germany.

10/01/2021

FR4 Thermal properties to consider when designing PCBs

10/14/2020

Learn how to remove heat from your PCB designs

10/02/2020

Webinar: Lab tests to ensure the quality of IMS Laminates with American Standard Circuits.

9/29/2020

Aismalibar Adds Steven Calvert As Field Applications Engineer

Archivo de etiquetas: Thermal management

Innovative Thermal Management Solutions for High Power Electronic Modules

Thermal FR4 by Aismalibar, the evolution of standard FR4

Dielectric Film as TIM in Power Electronic Applications

BOND SHEET CURED + AIR GAP FILLER

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)
50(1,2)

Air Gap Filler μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8)

80(3,1)

100(3,9)

ALPRIMER (ISOLAL)

BOND SHEET CURED + THERMAL TAPE

Last news

6/22/2022

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

5/06/2022

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

4/09/2022

These are the new TIMs for power electronics

3/09/2022

Improved Thermal Interface Materialsfor Cooling High-Power Electronics

11/16/2021

Aismalibar’s new range of Thermal Interface Material (TIM).

11/16/2021

AISMALIBAR to exhibit at 2021 Productronica, November 16-19, 2021 in Munich, Germany.

10/01/2021

FR4 Thermal properties to consider when designing PCBs

10/14/2020

Learn how to remove heat from your PCB designs

10/02/2020

Webinar: Lab tests to ensure the quality of IMS Laminates with American Standard Circuits.

9/29/2020

Aismalibar Adds Steven Calvert As Field Applications Engineer

Archivo de etiquetas: Thermal management

Innovative Thermal Management Solutions for High Power Electronic Modules

Thermal FR4 by Aismalibar, the evolution of standard FR4

Dielectric Film as TIM in Power Electronic Applications

BOND SHEET CURED + AIR GAP FILLER

Air Gap Filler μm (mils) 50(2,0)

Bond Sheet Cured μm (mils)70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)50(1,2)

Air Gap Filler μm (mils)50(2,0)

Bond Sheet Cured μm (mils)70(2,8) 80(3,1) 100(3,9)

ALPRIMER (ISOLAL)

BOND SHEET CURED + THERMAL TAPE

Improved Thermal Interface Materials
for Cooling High-Power Electronics

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)
50(1,2)

Air Gap Filler μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8)

80(3,1)

100(3,9)