Improved Thermal Interface Materials
for Cooling High-Power Electronics

Heat has been a significant concern in electronics since the beginning of the electronics age when hot glowing vacuum tubes were first used to receive and transmit data bits. The transistor and integrated circuit effectively solved that basic problem, but increases in integration resulted in increased concentration of heat, exacerbated by relentless increases in operating frequency. While improvements in electronics technology have been able to mitigate many thermal issues at chip level thanks to improved semiconductor designs devised to operate at lower voltages (thus requiring less energy) the thermal management challenge continues to vex electronic product developers.

Moreover, with ever denser heterogeneous integration solutions now being introduced, this is expected to remain a concern to Improved Thermal Interface Materials for Cooling High-Power Electronics be addressed for the foreseeable future. Thermal engineers have long known that thermal energy must ultimately be “returned to the air” but getting it there in an efficient way is of great importance. They know also that there are but three basic ways of removing heat from a system: conduction, convection, and radiation; of these, conduction is by far the most efficient.

Thermal Interface Material Solutions

A recent development, underpinning Aismalibar’s new TIM concepts, is a new coating technology referred to by the company as its “air gap filler,” which in addition to its excellent thermal and electrical insulation properties, the need to employ an often complex and messy TIM thermal paste application.

A key objective of the air gap filler product is to eliminate voids which otherwise can result in “hot spots” at the interface.

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