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Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

junio 22, 2022 5:42 pm Publicado por Jonatan Deja tus comentarios

Aismalibar will be attending The Battery Show Europe in Stuttgart, Germany from June 28th to 30th, presenting its new solutions... Ver artículo

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

mayo 6, 2022 10:29 am Publicado por Jonatan Deja tus comentarios

For many years, The PCIM Europe is the world’s leading exhibition and conference for power electronics, intelligent motion, renewable energy,... Ver artículo

These are the new TIMs for power electronics

abril 9, 2022 8:27 am Publicado por Jonatan Deja tus comentarios

Thermal interface materials today combine thermal connection and electrical insulation. A new type of coating minimizes air pockets and makes... Ver artículo

Improved Thermal Interface Materials
for Cooling High-Power Electronics

marzo 9, 2022 8:01 am Publicado por Jonatan Deja tus comentarios

Heat has been a significant concern in electronics since the beginning of the electronics age when hot glowing vacuum tubes... Ver artículo

FR4 Thermal properties to consider when designing PCBs

octubre 1, 2021 9:21 am Publicado por webmaster Deja tus comentarios

When designing PCBs, designers need to consider four very important thermal properties of the FR4 they have chosen to incorporate. In this article, we discuss these crucial properties and explain how Aismalibar's thermal FR4 responds to them.

Aismalibar Adds Steven Calvert As Field Applications Engineer

septiembre 29, 2020 11:01 am Publicado por Jonatan Deja tus comentarios

Steven joins the Aismalibar team with over 25 years’ experience working within the European and North American Manufacturing industries. He... Ver artículo

Aismalibar experts in thermal management

Innovative Thermal Management Solutions for High Power Electronic Modules

julio 16, 2021 9:42 am Publicado por webmaster Deja tus comentarios

In this article we propose Aismalibar‘s thermal solutions for high power electronic modules. The current trend in power electronics in... Ver artículo

Thermal FR4 by Aismalibar, the evolution of standard FR4

junio 7, 2021 9:28 am Publicado por webmaster Deja tus comentarios

Thermal FR4 by Aismalibar is a revolutionary FR4 enriched with mineral filler, capable of dissipating the heat more efficiently that a... Ver artículo

Dielectric Film as TIM in Power Electronic Applications

junio 1, 2021 9:55 am Publicado por webmaster Deja tus comentarios

The omnipresent trend in electronics is towards smaller designs with increasing performance requirements. As a consequence , there is the... Ver artículo

Aismalibar to attend the PCIM Europe digital days from 3-7 May 2021

abril 23, 2021 10:01 am Publicado por Jonatan Deja tus comentarios

Aismalibar to attend the PCIM Europe digital days from 3-7 May 2021 For many years, the PCIM event has been... Ver artículo

1 2 Siguiente »

	Total thickness
Bond Sheet Cured 70µm (ASTM 5476)	70 µm	4 KV	0,041 K/W	2,2 W/mK
Bond Sheet Cured 100µm (ASTM 5476)	100 µm	6 KV	0,058 K/W	2,2 W/mK
Bond Sheet Cured 70µm + Air Gap Filler	120 µm	4,2 KV	0,07 K/W	2,2 W/mK
Bond Sheet Cured 100µm + Air Gap Filler	150 µm	6,2 KV	0,088 K/W	2,2 W/mK
Air gap filler + Bond Sheet Cured 70µm + Air gap filler	170 µm	4,4 KV	0,099 K/W	2,2 W/mK
Air gap filler + Bond Sheet Cured 100µm + Air gap filler	200 µm	6,4 KV	0,117 K/W	2,2 W/mK
Bond Sheet Cured 80µm High Tg (ASTM 5476)	80 µm	4 KV	0,031 K/W	3,2 W/mK
Bond Sheet Cured 80µm High Tg + Air gap filler	130 µm	4,2 KV	0,051 K/W	3,2 W/mK
Air gap filler + Bond Sheet Cured 80µm HTg + Air gap filler	180 µm	4,4 KV	0,070 K/W	3,2 W/mK

Bond sheet cured 70µm (ASTM5476)
Total thickness	70µm
Dialectric capacity	4KV
Thermal resistance Rth	0,041K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm (ASTM 5476)
Total thickness	100µm
Dialectric capacity	6KV
Thermal resistance Rth	0,058K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 70µm + Air gap filler
Total thickness	120µm
Dialectric capacity	4,2KV
Thermal resistance Rth	0,07K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm + Air gap filler
Total thickness	150µm
Dialectric capacity	6,2KV
Thermal resistance Rth	0,88K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Last news

6/22/2022

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

5/06/2022

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

4/09/2022

These are the new TIMs for power electronics

3/09/2022

Improved Thermal Interface Materials
for Cooling High-Power Electronics

11/16/2021

Aismalibar’s new range of Thermal Interface Material (TIM).

11/16/2021

AISMALIBAR to exhibit at 2021 Productronica, November 16-19, 2021 in Munich, Germany.

10/01/2021

FR4 Thermal properties to consider when designing PCBs

10/14/2020

Learn how to remove heat from your PCB designs

10/02/2020

Webinar: Lab tests to ensure the quality of IMS Laminates with American Standard Circuits.

9/29/2020

Aismalibar Adds Steven Calvert As Field Applications Engineer

Categories for Sin categorizar

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

These are the new TIMs for power electronics

Improved Thermal Interface Materials
for Cooling High-Power Electronics

FR4 Thermal properties to consider when designing PCBs

Aismalibar Adds Steven Calvert As Field Applications Engineer

Innovative Thermal Management Solutions for High Power Electronic Modules

Thermal FR4 by Aismalibar, the evolution of standard FR4

Dielectric Film as TIM in Power Electronic Applications

Aismalibar to attend the PCIM Europe digital days from 3-7 May 2021

BOND SHEET CURED + AIR GAP FILLER

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)
50(1,2)

Air Gap Filler μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8)

80(3,1)

100(3,9)

ALPRIMER (ISOLAL)

BOND SHEET CURED + THERMAL TAPE

	Total Thickness (µm)	Dielectric capacity (KV)	Thermal Resistance Rth (K/W)	Thermal Conductivity
Bond Sheet Cured 70µm + Thermal Tape	120	4,5	0,09	2,2 W/mk	Technical Data Sheet
Bond Sheet Cured 100µm + Thermal Tape	150	6,5	0,107	2,2 W/mk	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 70µm + Thermal Tape	170	4,7	0,119	2,2 W/mk	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 100µm + Thermal Tape	200	6,7	0,136	2,2 W/mk	Technical Data Sheet
Bond Sheet Cured 80µm High Tg + Thermal Tape	130	4,5	0,08	3,2 W/mK	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 80µm High Tg + Thermal Tape	180	4,7	0,099	3,2 W/mK	Technical Data Sheet

Last news

6/22/2022

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

5/06/2022

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

4/09/2022

These are the new TIMs for power electronics

3/09/2022

Improved Thermal Interface Materialsfor Cooling High-Power Electronics

11/16/2021

Aismalibar’s new range of Thermal Interface Material (TIM).

11/16/2021

AISMALIBAR to exhibit at 2021 Productronica, November 16-19, 2021 in Munich, Germany.

10/01/2021

FR4 Thermal properties to consider when designing PCBs

10/14/2020

Learn how to remove heat from your PCB designs

10/02/2020

Webinar: Lab tests to ensure the quality of IMS Laminates with American Standard Circuits.

9/29/2020

Aismalibar Adds Steven Calvert As Field Applications Engineer

Categories for Sin categorizar

BOND SHEET CURED + AIR GAP FILLER

Air Gap Filler μm (mils) 50(2,0)

Bond Sheet Cured μm (mils)70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)50(1,2)

Air Gap Filler μm (mils)50(2,0)

Bond Sheet Cured μm (mils)70(2,8) 80(3,1) 100(3,9)

ALPRIMER (ISOLAL)

BOND SHEET CURED + THERMAL TAPE

Improved Thermal Interface Materials
for Cooling High-Power Electronics

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)
50(1,2)

Air Gap Filler μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8)

80(3,1)

100(3,9)