These are the new TIMs for power electronics

Thermal interface materials today combine thermal connection and electrical insulation. A new type of coating minimizes air pockets and makes thermal paste superfluous.

The thermal interface materials of the current family from Aismalibar offer not only electrical insulation and good thermal coupling but also easy assembly without thermal paste.

The thermal interface materials of the current family from Aismalibar offer not only electrical insulation and good thermal coupling but also easy assembly without thermal paste.

The ubiquitous trend in electronics towards ever higher power densities requires the heat generated by the electronics to be dissipated as quickly, effectively and cost-effectively as possible. A well-balanced thermal management concept enables a longer service life for the electronic components and thus higher performance and quality of the entire electronic assembly.

When designing the new family of thermal interface materials (TIM), AISMALIBAR paid particular attention to developing effective and durable TIMs for use in high-volume production in the automotive sector, among other things.

Thermal interface materials are used in power electronics modules to dissipate the heat generated by the power components on the printed circuit board into a cooling chain or to a subsequent cooling element.

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