IMS - METAL CLAD COBRITHERM ULTRATHIN

COBRITHERM ULTRATHIN 4,0W 35µm Tg 180ºC

FamilyIMS - METAL CLAD

ProductCOBRITHERM ULTRATHIN

TypeHTC

Dielectric Layer(μm)35

Thermal Resistance (K/W)0,031

Thermal Conductivity (W/mk)3,8

Elec. TEST V(DC)750

Brake down voltage V(AC)1800

ComformableNO

Ideal for high temperatureExcellet

Dielectric strengthLow

Insulation GuarantyYES

Das neue COBRITHERM ULTRATHIN. Höchste am Markt verfügbare Wärmeleitfähigkeit von 4W (ASTM), kombiniert mit 150° MOT und einem Tg 180°, bei gleichzeitiger Reduzierung des CTE. Dies ermöglicht den Einsatz von MPCBs in Hochtemperatur-Anwendungen, wie zum Beispiel Automotive.

Downloads Product composition Applications

Catalogues

COBRITHERM ULTRATHIN Leaflet with IMS- METAL CLAD products: COBRITHERM ULTRATHIN Download

Datasheets

COBRITHERM ULTRATHIN 4,0W 35µm Tg180ºC IMS- METAL CLAD - COBRITHERM ULTRATHIN Download

Front Lights

Power LED Packages

Street Lighting

Stadiums and Arenas

Industrial and Horticulture

COBRITHERM ULTRATHIN other products

COBRITHERM ULTRATHIN 4,0W 35µm Tg 180ºC

TypeHTC

Dielectric Layer (μm)35

Thermal Conductivity (W/mk)3,8

COBRITHERM ULTRATHIN 4,0W 50µm Tg 180ºC

TypeHTC

Dielectric Layer (μm)50

Thermal Conductivity (W/mk)3,8

COBRITHERM ULTRATHIN 4,0W 75µm Tg 180ºC

TypeHTC

Dielectric Layer (μm)75

Thermal Conductivity (W/mk)3,8

COBRITHERM ULTRATHIN 3,2W 75µm

TypeHTC

Dielectric Layer (μm)75

Thermal Conductivity (W/mk)3,2

COBRITHERM ULTRATHIN 3,2W 100µm

TypeHTC

Dielectric Layer (μm)100

Thermal Conductivity (W/mk)3,0

COBRITHERM ULTRATHIN 4,0W 100µm Tg180ºC

TypeHTC

Dielectric Layer (μm)100

Thermal Conductivity (W/mk)3,8

COBRITHERM ULTRATHIN Low Modulus 3,2W 100µm

TypeHTC

Dielectric Layer (μm)100

Thermal Conductivity (W/mk)3,0

COBRITHERM ULTRATHIN 3,2W 50µm

TypeHTC

Dielectric Layer (μm)50

Thermal Conductivity (W/mk)3,2

COBRITHERM ULTRATHIN 3,2W 35µm 750V DC

TypeHTC

Dielectric Layer (μm)35

Thermal Conductivity (W/mk)3,2

COBRITHERM ULTRATHIN 3,2W 35µm 1000V DC

TypeHTC

Dielectric Layer (μm)35

Thermal Conductivity (W/mk)3,2

Check our product finder

	Total thickness
Bond Sheet Cured 70µm (ASTM 5476)	70 µm	4 KV	0,041 K/W	2,2 W/mK
Bond Sheet Cured 100µm (ASTM 5476)	100 µm	6 KV	0,058 K/W	2,2 W/mK
Bond Sheet Cured 70µm + Air Gap Filler	120 µm	4,2 KV	0,07 K/W	2,2 W/mK
Bond Sheet Cured 100µm + Air Gap Filler	150 µm	6,2 KV	0,088 K/W	2,2 W/mK
Air gap filler + Bond Sheet Cured 70µm + Air gap filler	170 µm	4,4 KV	0,099 K/W	2,2 W/mK
Air gap filler + Bond Sheet Cured 100µm + Air gap filler	200 µm	6,4 KV	0,117 K/W	2,2 W/mK
Bond Sheet Cured 80µm High Tg (ASTM 5476)	80 µm	4 KV	0,031 K/W	3,2 W/mK
Bond Sheet Cured 80µm High Tg + Air gap filler	130 µm	4,2 KV	0,051 K/W	3,2 W/mK
Air gap filler + Bond Sheet Cured 80µm HTg + Air gap filler	180 µm	4,4 KV	0,070 K/W	3,2 W/mK

Bond sheet cured 70µm (ASTM5476)
Total thickness	70µm
Dialectric capacity	4KV
Thermal resistance Rth	0,041K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm (ASTM 5476)
Total thickness	100µm
Dialectric capacity	6KV
Thermal resistance Rth	0,058K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 70µm + Air gap filler
Total thickness	120µm
Dialectric capacity	4,2KV
Thermal resistance Rth	0,07K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm + Air gap filler
Total thickness	150µm
Dialectric capacity	6,2KV
Thermal resistance Rth	0,88K/W
Thermal conductivity	2,2W/mK
Technical data sheet

	Total Thickness (µm)	Dielectric capacity (KV)	Thermal Resistance Rth (K/W)	Thermal Conductivity
Bond Sheet Cured 70µm + Thermal Tape	120	4,5	0,09	2,2 W/mk	Technical Data Sheet
Bond Sheet Cured 100µm + Thermal Tape	150	6,5	0,107	2,2 W/mk	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 70µm + Thermal Tape	170	4,7	0,119	2,2 W/mk	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 100µm + Thermal Tape	200	6,7	0,136	2,2 W/mk	Technical Data Sheet
Bond Sheet Cured 80µm High Tg + Thermal Tape	130	4,5	0,08	3,2 W/mK	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 80µm High Tg + Thermal Tape	180	4,7	0,099	3,2 W/mK	Technical Data Sheet

Last news

6/22/2022

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

5/06/2022

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

4/09/2022

These are the new TIMs for power electronics

3/09/2022

Improved Thermal Interface Materialsfor Cooling High-Power Electronics

11/16/2021

Aismalibar’s new range of Thermal Interface Material (TIM).

11/16/2021

AISMALIBAR to exhibit at 2021 Productronica, November 16-19, 2021 in Munich, Germany.

10/01/2021

FR4 Thermal properties to consider when designing PCBs

10/14/2020

Learn how to remove heat from your PCB designs

10/02/2020

Webinar: Lab tests to ensure the quality of IMS Laminates with American Standard Circuits.

9/29/2020

Aismalibar Adds Steven Calvert As Field Applications Engineer

Catalogues

Datasheets

COBRITHERM ULTRATHIN 4,0W 35µm Tg 180ºC

COBRITHERM ULTRATHIN 4,0W 50µm Tg 180ºC

COBRITHERM ULTRATHIN 4,0W 75µm Tg 180ºC

COBRITHERM ULTRATHIN 3,2W 75µm

COBRITHERM ULTRATHIN 3,2W 100µm

COBRITHERM ULTRATHIN 4,0W 100µm Tg180ºC

COBRITHERM ULTRATHIN Low Modulus 3,2W 100µm

COBRITHERM ULTRATHIN 3,2W 50µm

COBRITHERM ULTRATHIN 3,2W 35µm 750V DC

COBRITHERM ULTRATHIN 3,2W 35µm 1000V DC

BOND SHEET CURED + AIR GAP FILLER

Air Gap Filler μm (mils) 50(2,0)

Bond Sheet Cured μm (mils)70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)50(1,2)

Air Gap Filler μm (mils)50(2,0)

Bond Sheet Cured μm (mils)70(2,8) 80(3,1) 100(3,9)

ALPRIMER (ISOLAL)

BOND SHEET CURED + THERMAL TAPE

Improved Thermal Interface Materials
for Cooling High-Power Electronics

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)
50(1,2)

Air Gap Filler μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8)

80(3,1)

100(3,9)