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IMS - METAL CLAD COBRITHERM

COBRITHERM HTC COPPER BASE 3,2W 130µm

FamilyIMS - METAL CLAD

ProductCOBRITHERM

TypeHTC COPPER BASE

Dielectric Layer(μm)130

Thermal Resistance (K/W)0,135

Thermal Conductivity (W/mk)3,2

Elec. TEST V(DC)-

Brake down voltage V(AC)3000

Comformable*

Ideal for high temperatureExcellent

Dielectric strengthMedium

Insulation GuarantyYES

Cobitherm HTC ist ein hoch wärmeleitfähiges, isoliertes Metalsubstrat (IMS), mit einer Kupfergrundbeschichtung sowie einer, auf der anderen Seite angebrachten ED-Kupferfolie. Ausgelegt für eine zuverlässige Wärmeabfuhr in Schaltkreisen. Die Verwendung der Kupfergrundbeschichtung reduziert den Wärmewiderstand zwischen der funktionalen Kupferschicht und dem Basismaterial. Die 130 µm starke Dielektrikschicht ist für einen Einsatz bei externer Hochleistungselektronik bestens geeignet, in dem Fall, dass ein Bedarf an Wärmeabfuhr besteht.

Ein Dielektrikum aus verstärktem Keramik-Polymer aus eigener Entwicklung und eigener Herstellung zeichnet sich durch eine hohe Wärmeleitfähigkeit von 3,2 W/mK und einer hohen Durchschlagsfestigkeit aus und garantiert eine optimale Leistung.

Die gesamte COBRITHERM-Produktpalette wird am Ende der Fertigung einem 100%-Durchschlagsfestigkeits-Test unterzogen. AISMALIBAR prüft die Durchschlagsfestigkeit der Isolierung zwischen den Kupfer- und Aluminiumschichten bei Hochspannung.

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COBRITHERM other products

COBRITHERM HTC COPPER BASE 3,2W 130µm

TypeHTC COPPER BASE

Dielectric Layer (μm)130

Thermal Conductivity (W/mk)3,2
COBRITHERM HTC COPPER BASE 2,2W 130µm

TypeHTC COPPER BASE

Dielectric Layer (μm)130

Thermal Conductivity (W/mk)2,2
COBRITHERM HTC 2,2W 150µm

TypeHTC

Dielectric Layer (μm)150

Thermal Conductivity (W/mk)2,2
COBRITHERM HTC 3,2W 130µm

TypeHTC

Dielectric Layer (μm)130

Thermal Conductivity (W/mk)3,2
COBRITHERM HTC 2,2W 130µm

TypeHTC

Dielectric Layer (μm)130

Thermal Conductivity (W/mk)2,2
COBRITHERM HTC 3,2W 90µm

TypeHTC

Dielectric Layer (μm)90

Thermal Conductivity (W/mk)3,2
COBRITHERM HTC 2,2W 90µm

TypeHTC

Dielectric Layer (μm)90

Thermal Conductivity (W/mk)2,2
COBRITHERM ALCUP G-NT 1,3W 100µm

TypeALCUP G-NT

Dielectric Layer (μm)100

Thermal Conductivity (W/mk)1,3
COBRITHERM ALCUP G 1,3W 120µm

TypeALCUP G

Dielectric Layer (μm)120

Thermal Conductivity (W/mk)1,3
COBRITHERM ALCUP 1,8W 120µm

TypeALCUP

Dielectric Layer (μm)120

Thermal Conductivity (W/mk)1,8
COBRITHERM ALCUP 1,8W 100µm

TypeALCUP

Dielectric Layer (μm)100

Thermal Conductivity (W/mk)1,8
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BOND SHEET CURED + AIR GAP FILLER

Ultra-thin dielectric layer, high dielectric strength,
high thermal conductivity and low thermal resistance.
Montaje_1

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)
50(1,2)

Air Gap Filler μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8)
80(3,1)
100(3,9)

Total thickness
Dielectric capacity
Thermal resistance Rth
Thermal conductivity
Bond Sheet Cured 70µm (ASTM 5476)
70 µm
4 KV
0,041 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 100µm (ASTM 5476)
100 µm
6 KV
0,058 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 70µm + Air Gap Filler
120 µm
4,2 KV
0,07 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 100µm + Air Gap Filler
150 µm
6,2 KV
0,088 K/W
2,2 W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 70µm + Air gap filler
170 µm
4,4 KV
0,099 K/W
2,2 W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 100µm + Air gap filler
200 µm
6,4 KV
0,117 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg (ASTM 5476)
80 µm
4 KV
0,031 K/W
3,2 W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg + Air gap filler
130 µm
4,2 KV
0,051 K/W
3,2 W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 80µm HTg + Air gap filler
180 µm
4,4 KV
0,070 K/W
3,2 W/mK
Technical data sheet
Dielectric capacity Dielectric capacity Thermal resistance Rth Thermal resistance Rth Thermal conductivity Thermal conductivity
Bond sheet cured 70µm (ASTM5476)
Total thickness
70µm
Dialectric capacity
4KV
Thermal resistance Rth
0,041K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Bond Sheet Cured 100µm (ASTM 5476)
Total thickness
100µm
Dialectric capacity
6KV
Thermal resistance Rth
0,058K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Bond Sheet Cured 70µm + Air gap filler
Total thickness
120µm
Dialectric capacity
4,2KV
Thermal resistance Rth
0,07K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Bond Sheet Cured 100µm + Air gap filler
Total thickness
150µm
Dialectric capacity
6,2KV
Thermal resistance Rth
0,88K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 70µm + Air gap filler
Total thickness
170µm
Dialectric capacity
4,4KV
Thermal resistance Rth
0,99K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 100µm + Air gap filler
Total thickness
200µm
Dialectric capacity
6,4KV
Thermal resistance Rth
0,117K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg (ASTM 5476)
Total thickness
80µm
Dialectric capacity
4KV
Thermal resistance Rth
0,031K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg + Air gap filler
Total thickness
130µm
Dialectric capacity
4,2KV
Thermal resistance Rth
0,051K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 80µm High Tg + Air gap filler
Total thickness
180µm
Dialectric capacity
4,4KV
Thermal resistance Rth
0,070K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Bond sheet cured 70µm (ASTM5476)
Total Thickness
70 µm
Dialectric capacity
4 KV
Thermal resistance Rth
0,041K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 100µm (ASTM5476)
Total Thickness
100 µm
Dialectric capacity
6 KV
Thermal resistance Rth
0,058 K/W
Thermal conductivity
2,2 W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 70µm + Air gap filler
Total Thickness
120 µm
Dialectric capacity
4,2 KV
Thermal resistance Rth
0,07 K/W
Thermal conductivity
2,2 W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 100µm + Air gap filler
Total Thickness
150 µm
Dialectric capacity
6,2 KV
Thermal resistance Rth
0,88 K/W
Thermal conductivity
2,2 W/mK
Technical data sheet
Technical data sheet
Air gap filler + Bond Sheet Cured 70µm + Air gap filler
Total Thickness
170 µm
Dialectric capacity
4,4 KV
Thermal resistance Rth
0,99 K/W
Thermal conductivity
3,2 W/mK
Technical data sheet
Technical data sheet
Air gap filler + Bond Sheet Cured 100µm + Air gap filler
Total Thickness
200 µm
Dialectric capacity
6,4 KV
Thermal resistance Rth
0,117 K/W
Thermal conductivity
3,2 W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 80µm High Tg (ASTM 5476)
Total Thickness
80 µm
Dialectric capacity
4 KV
Thermal resistance Rth
0,031 K/W
Thermal conductivity
3,2 W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 80µm High Tg + Air gap filler
Total Thickness
130 µm
Dialectric capacity
4,2 KV
Thermal resistance Rth
0,051 K/W
Thermal conductivity
3,2 W/mK
Technical data sheet
Technical data sheet
Air gap filler + Bond Sheet Cured 80µm High Tg + Air gap filler
Total Thickness
180 µm
Dialectric capacity
4,4 KV
Thermal resistance Rth
0,070 K/W
Thermal conductivity
3,2 W/mK
Technical data sheet
Technical data sheet

ALPRIMER (ISOLAL)

Aluminum laminate coated with a thermal conductive ultra-thin dielectric layer.

Imagen1

Insulation thickness µm (in)

100(3,9)

Aluminium thickness um (In)

1000 (0.039)/ 1500 (0.059)/2000(0.078)/3000 (0.12)

Dielectric capacity (KV)
ALP
6
Technical Data Sheet

BOND SHEET CURED + THERMAL TAPE

Adhesive film with thermal transmission combined with an ultra-thin dielectric layer.

Thermal Tape um (mllc)

50 (1.9)

Dielectric thickness µm (mlic)

70(2,8)/80(3,1) / 100(3,9)

Total Thickness (µm)
Dielectric capacity (KV)
Thermal Resistance Rth (K/W)
Thermal Conductivity
Bond Sheet Cured 70µm + Thermal Tape
120
4,5
0,09
2,2 W/mk
Technical Data Sheet
Bond Sheet Cured 100µm + Thermal Tape
150
6,5
0,107
2,2 W/mk
Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 70µm + Thermal Tape
170
4,7
0,119
2,2 W/mk
Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 100µm + Thermal Tape
200
6,7
0,136
2,2 W/mk
Technical Data Sheet
Bond Sheet Cured 80µm High Tg + Thermal Tape
130
4,5
0,08
3,2 W/mK
Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 80µm High Tg + Thermal Tape
180
4,7
0,099
3,2 W/mK
Technical Data Sheet

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