Categories for Unkategorisiert

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

Juni 22, 2022 5:42 pm Veröffentlicht von Jonatan Schreibe einen Kommentar

Aismalibar will be attending The Battery Show Europe in Stuttgart, Germany from June 28th to 30th, presenting its new solutions... Artikel ansehen

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

Mai 6, 2022 10:29 am Veröffentlicht von Jonatan Schreibe einen Kommentar

For many years, The PCIM Europe is the world’s leading exhibition and conference for power electronics, intelligent motion, renewable energy,... Artikel ansehen

These are the new TIMs for power electronics

April 9, 2022 8:27 am Veröffentlicht von Jonatan Schreibe einen Kommentar

Thermal interface materials today combine thermal connection and electrical insulation. A new type of coating minimizes air pockets and makes... Artikel ansehen

Improved Thermal Interface Materials
for Cooling High-Power Electronics

März 9, 2022 8:01 am Veröffentlicht von Jonatan Schreibe einen Kommentar

Heat has been a significant concern in electronics since the beginning of the electronics age when hot glowing vacuum tubes... Artikel ansehen

FR4 Thermal properties to consider when designing PCBs

Oktober 1, 2021 9:21 am Veröffentlicht von webmaster Schreibe einen Kommentar

When designing PCBs, designers need to consider four very important thermal properties of the FR4 they have chosen to incorporate. In this article, we discuss these crucial properties and explain how Aismalibar's thermal FR4 responds to them.

Aismalibar Adds Steven Calvert As Field Applications Engineer

September 29, 2020 11:01 am Veröffentlicht von Jonatan Schreibe einen Kommentar

Steven joins the Aismalibar team with over 25 years’ experience working within the European and North American Manufacturing industries. He... Artikel ansehen

Innovative Thermal Management Solutions for High Power Electronic Modules

Juli 16, 2021 9:42 am Veröffentlicht von webmaster Schreibe einen Kommentar

In this article we propose Aismalibar’s thermal solutions for high power electronic modules. The current trend in power electronics in... Artikel ansehen

Thermal FR4 by Aismalibar, the evolution of standard FR4

Juni 7, 2021 9:28 am Veröffentlicht von webmaster Schreibe einen Kommentar

Thermal FR4 by Aismalibar is a revolutionary FR4 enriched with mineral filler, capable of dissipating the heat more efficiently that a... Artikel ansehen

Dielectric Film as TIM in Power Electronic Applications

Juni 1, 2021 9:55 am Veröffentlicht von webmaster Schreibe einen Kommentar

The omnipresent trend in electronics is towards smaller designs with increasing performance requirements. As a consequence , there is the... Artikel ansehen

Aismalibar ist Aussteller der „PCIM Europe Digital Days“ vom 3. bis 7. Mai 2021

April 23, 2021 10:08 am Veröffentlicht von Jonatan Schreibe einen Kommentar

Seit vielen Jahren ist die PCIM die weltweit führende Messe und Konferenz für die Leistungselektronik, intelligente Antriebstechnik, erneuerbare Energien und... Artikel ansehen

1 2 Weiter »

	Total thickness
Bond Sheet Cured 70µm (ASTM 5476)	70 µm	4 KV	0,041 K/W	2,2 W/mK
Bond Sheet Cured 100µm (ASTM 5476)	100 µm	6 KV	0,058 K/W	2,2 W/mK
Bond Sheet Cured 70µm + Air Gap Filler	120 µm	4,2 KV	0,07 K/W	2,2 W/mK
Bond Sheet Cured 100µm + Air Gap Filler	150 µm	6,2 KV	0,088 K/W	2,2 W/mK
Air gap filler + Bond Sheet Cured 70µm + Air gap filler	170 µm	4,4 KV	0,099 K/W	2,2 W/mK
Air gap filler + Bond Sheet Cured 100µm + Air gap filler	200 µm	6,4 KV	0,117 K/W	2,2 W/mK
Bond Sheet Cured 80µm High Tg (ASTM 5476)	80 µm	4 KV	0,031 K/W	3,2 W/mK
Bond Sheet Cured 80µm High Tg + Air gap filler	130 µm	4,2 KV	0,051 K/W	3,2 W/mK
Air gap filler + Bond Sheet Cured 80µm HTg + Air gap filler	180 µm	4,4 KV	0,070 K/W	3,2 W/mK

Bond sheet cured 70µm (ASTM5476)
Total thickness	70µm
Dialectric capacity	4KV
Thermal resistance Rth	0,041K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm (ASTM 5476)
Total thickness	100µm
Dialectric capacity	6KV
Thermal resistance Rth	0,058K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 70µm + Air gap filler
Total thickness	120µm
Dialectric capacity	4,2KV
Thermal resistance Rth	0,07K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm + Air gap filler
Total thickness	150µm
Dialectric capacity	6,2KV
Thermal resistance Rth	0,88K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Last news

6/22/2022

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

5/06/2022

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

4/09/2022

These are the new TIMs for power electronics

3/09/2022

Improved Thermal Interface Materials
for Cooling High-Power Electronics

11/16/2021

Aismalibar’s new range of Thermal Interface Material (TIM).

11/16/2021

AISMALIBAR to exhibit at 2021 Productronica, November 16-19, 2021 in Munich, Germany.

10/01/2021

FR4 Thermal properties to consider when designing PCBs

10/14/2020

Learn how to remove heat from your PCB designs

10/02/2020

Webinar: Lab tests to ensure the quality of IMS Laminates with American Standard Circuits.

9/29/2020

Aismalibar Adds Steven Calvert As Field Applications Engineer

Categories for Unkategorisiert

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

These are the new TIMs for power electronics

Improved Thermal Interface Materials
for Cooling High-Power Electronics

FR4 Thermal properties to consider when designing PCBs

Aismalibar Adds Steven Calvert As Field Applications Engineer

Innovative Thermal Management Solutions for High Power Electronic Modules

Thermal FR4 by Aismalibar, the evolution of standard FR4

Dielectric Film as TIM in Power Electronic Applications

Aismalibar ist Aussteller der „PCIM Europe Digital Days“ vom 3. bis 7. Mai 2021

BOND SHEET CURED + AIR GAP FILLER

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)
50(1,2)

Air Gap Filler μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8)

80(3,1)

100(3,9)

ALPRIMER (ISOLAL)

BOND SHEET CURED + THERMAL TAPE

	Total Thickness (µm)	Dielectric capacity (KV)	Thermal Resistance Rth (K/W)	Thermal Conductivity
Bond Sheet Cured 70µm + Thermal Tape	120	4,5	0,09	2,2 W/mk	Technical Data Sheet
Bond Sheet Cured 100µm + Thermal Tape	150	6,5	0,107	2,2 W/mk	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 70µm + Thermal Tape	170	4,7	0,119	2,2 W/mk	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 100µm + Thermal Tape	200	6,7	0,136	2,2 W/mk	Technical Data Sheet
Bond Sheet Cured 80µm High Tg + Thermal Tape	130	4,5	0,08	3,2 W/mK	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 80µm High Tg + Thermal Tape	180	4,7	0,099	3,2 W/mK	Technical Data Sheet

Last news

6/22/2022

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

5/06/2022

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

4/09/2022

These are the new TIMs for power electronics

3/09/2022

Improved Thermal Interface Materialsfor Cooling High-Power Electronics

11/16/2021

Aismalibar’s new range of Thermal Interface Material (TIM).

11/16/2021

AISMALIBAR to exhibit at 2021 Productronica, November 16-19, 2021 in Munich, Germany.

10/01/2021

FR4 Thermal properties to consider when designing PCBs

10/14/2020

Learn how to remove heat from your PCB designs

10/02/2020

Webinar: Lab tests to ensure the quality of IMS Laminates with American Standard Circuits.

9/29/2020

Aismalibar Adds Steven Calvert As Field Applications Engineer

Categories for Unkategorisiert

BOND SHEET CURED + AIR GAP FILLER

Air Gap Filler μm (mils) 50(2,0)

Bond Sheet Cured μm (mils)70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)50(1,2)

Air Gap Filler μm (mils)50(2,0)

Bond Sheet Cured μm (mils)70(2,8) 80(3,1) 100(3,9)

ALPRIMER (ISOLAL)

BOND SHEET CURED + THERMAL TAPE

Improved Thermal Interface Materials
for Cooling High-Power Electronics

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)
50(1,2)

Air Gap Filler μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8)

80(3,1)

100(3,9)