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7/26/2019

Aismalibar to attend „Advancements in Thermal Management“ Conference

Events & Fairs

Aismalibar is pleased to announce its attendance at this year’s „Advancements in Thermal Management“ in Denver, Colorado on August 7 and 8. The conference brings together design engineers, academia, system engineers, material scientists, CTOs and R&D managers with organizations in industries and markets whose products, operations and services require precise control of thermal properties and states.

The company will have a space in the fair where it will present the novelties of its products in the line of the event, that is to say, the novelties and the advances in questions related to thermal management and technology.

The Advancements in Thermal Management event shows attendees the latest advances in thermal management and temperature mitigation, addressing topics such as electronic packaging, air and liquid refrigeration, heat pipes, thermal materials / TIMS, detection and control of temperature, design and management of the system for the optimization of thermal properties.

Aismalibar will attend the event as an exhibitor and showcase the following products:

COBRITHEM Insulate Metal Substrates are produced with a variety of thicknesses of both aluminum or copper and can be clad with different mixtures of dielectric layers to meet the ever-changing demands of the industry. The material can be produced in a variety of styles ranging from thin layers as small as 50 microns to ensure excellent thermal impedance and up to 130 microns, allowing it to withstand high insulation in between the conductive metal layer.

COBRITHERM ULTRATHIN integrates an innovative ultra-thin dielectric layer that provides higher thermal performance, excellent working temperature and reduces thermal resistance. The new COBRITHERM ULTRA THIN 4W Tg of 180ºC and an 150ºC MOT offers industry leading thermal conductivity, strong MOT values, High Tg and Low CTE which are the key elements for performance of MPCBs operating at high temperatures

FASTHERM is a new technology developed to achieve a faster thermal transition from the LED thermal pad to the heat sink. This superior thermal transition can be achieved by using the entire COBRITHERM HTC product range with either a copper or copper/aluminium base.

FLEXTHERM is a high technology thermal IMS for use in the production of conformable metal printed circuit boards that can be bent without compromising the initial dielectric strength between conductive layers. Its low thermal impedance allows the dissipation of temperature from the heating elements of a PCB into FLEXTHERM’s metal core at an extremely efficient rate.

As thermal management becomes more challenging on multilayer PCBs constructions, AISMALIBAR has developed different substrates that can be combined to offer tailored solutions. These substrates are required in the case of complex boards with denser circuitry.

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