Aismalibar to Showcase Advanced Thermal Management Solutions at APEC 2026

March 2026 | Aismalibar

Aismalibar, a global leader in high-performance thermal management materials, will exhibit at APEC 2026 (Applied Power Electronics Conference), taking place March 22–26, 2026, in San Antonio, Texas, at the Henry B. González Convention Center. Attendees can visit Aismalibar at Booth 221, where the company will showcase advanced thermal management solutions designed for demanding power electronics applications.

As one of the world’s premier events for the power electronics industry, APEC brings together engineers, designers, manufacturers, and industry leaders to explore the latest developments in power electronics technologies.

Advanced Thermal Interface Materials (TIMs) for Power Electronics

Aismalibar’s TIM portfolio is designed to address the critical need for efficient thermal transfer while ensuring electrical insulation when required. Our TIM solutions are classified based on dielectric capacity, which is determined by the device’s operating voltage and regulatory insulation requirements. Additionally, Aismalibar has developed self-adhesive and non-adhesive surface treatments to minimise air gaps between the TIM, heatsinks, and electronic components, thereby enhancing thermal transfer efficiency.

Glass-Free Thermally Conductive PCB Dielectric for High-Power Applications

Aismalibar introduces a next-generation, glass-free, thermally conductive dielectric for single-sided and multilayer PCBs. This innovative material provides:

  • Thermal conductivity up to 10 W/mK, significantly improving heat dissipation compared to traditional laminates.
  • Dielectric thickness options range from 50 to 200 microns, ensuring versatility across different PCB configurations.
  • High dielectric strength (3 – 10 kV), providing robust electrical insulation without sacrificing thermal efficiency.

By eliminating glass reinforcements, this glass-free bond sheet achieves superior thermal conductivity and mechanical flexibility, making it ideal for power electronics, automotive, and high-reliability applications.

IMS Metal Clad Substrates for High-Power Applications

Aismalibar’s IMS (Insulated Metal Substrate) solutions feature a thick aluminum base, laminated with ED copper foil, providing:

  • Superior thermal dissipation, reducing hotspots and improving system longevity.
  • High electrical insulation, achieved through Aismalibar’s proprietary polymer-ceramic formulation.
  • Compatibility with standard PCB manufacturing processes, enabling seamless integration without additional thermal management components.


Aismalibar’s IMS technology offers a cost-effective, high-performance alternative to conventional heat dissipation solutions, enabling direct SMD assembly and enhanced thermal endurance for automotive and industrial power modules, as well as LED lighting applications.

Visit Aismalibar at APEC 2026

Power electronics engineers, PCB designers, and thermal management specialists attending APEC 2026 are invited to visit Booth 221 to explore Aismalibar’s latest materials and technologies and discuss how these solutions can improve heat dissipation, electrical reliability, and system performance.

crossmenu