Aismalibar to Showcase Advanced Thermal Management Solutions at APEC 2025

Barcelona, Spain - Aismalibar, a global leader in high-performance thermal management materials, will exhibit at APEC 2025 (Applied Power Electronics Conference) in Atlanta, Georgia, from March 16–20, 2025. As the premier event for power electronics professionals, APEC provides a crucial platform for industry leaders to explore the latest advancements in thermal interface materials (TIMs), high-performance PCB laminates, and insulated metal substrates (IMS).

Aismalibar will showcase cutting-edge thermal management solutions at Booth 338, including new developments in TIMs and thermally conductive PCB laminates for multilayer PCBs and IMS applications. These materials are engineered to optimize heat dissipation, improve dielectric insulation, and enhance the reliability of power electronics systems.

Advanced Thermal Interface Materials (TIMs) for Power Electronics

Aismalibar’s TIM portfolio is designed to address the critical need for efficient thermal transfer while ensuring electrical insulation when required. Our TIM solutions are classified based on dielectric capacity, which is determined by the device’s operating voltage and regulatory insulation requirements. Additionally, Aismalibar has developed self-adhesive and non-adhesive surface treatments to minimize air gaps between the TIM, heatsinks, and electronic components, enhancing thermal transfer efficiency.

Glass-Free Thermally Conductive PCB Dielectric for High-Power Applications

Aismalibar introduces a next-generation, glass-free, thermally conductive dielectric for single-sided and multilayer PCBs. This innovative material provides:

• Thermal conductivity up to 10 W/mK, significantly improving heat dissipation compared to traditional laminates.
• Dielectric thickness options range from 50 to 200 microns, ensuring versatility across different PCB configurations.
• High dielectric strength (3 – 10 kV), providing robust electrical insulation without sacrificing thermal efficiency.

This glass-free bond sheet eliminates glass reinforcements, achieving superior thermal conductivity and mechanical flexibility. It is ideal for power electronics, automotive, and high-reliability applications.

IMS Metal Clad Substrates for High-Power Applications

Aismalibar’s IMS (Insulated Metal Substrate) solutions feature a thick aluminium base laminated with ED copper foil, providing:

• Superior thermal dissipation, reducing hotspots and improving system longevity.
• High electrical insulation is achieved through Aismalibar’s proprietary polymer-ceramic formulation.
• It is compatible with standard PCB manufacturing processes, enabling seamless integration without additional thermal management components.

Aismalibar’s IMS technology offers a cost-effective, high-performance alternative to conventional heat dissipation solutions. It allows direct SMD assembly and enhanced thermal endurance for automotive, industrial power modules, and LED lighting applications.

Visit Aismalibar at APEC 2025 – Booth 338

We invite PCB design engineers, thermal management specialists, and power electronics professionals to visit Booth 338 to explore our latest advancements in thermally optimized PCB laminates, TIMs, and IMS solutions. Our team will be available to discuss how Aismalibar materials can enhance performance, extend component lifespan, and improve overall system efficiency.

About Aismalibar

Founded in 1934 and headquartered in Barcelona, Spain, Aismalibar specializes in the design and manufacture of high-performance copper and metal-clad laminates and advanced thermal interface materials. Committed to reducing operating temperatures in power electronics, Aismalibar’s innovative materials improve component reliability, minimize the need for auxiliary cooling solutions, and reduce overall system costs.

Our products are ISO/TS 16949:2009 certified, RoHS compliant, and UL certified, ensuring the highest standards of quality, safety, and environmental compliance. Aismalibar materials are widely used in LED lighting, telecommunications, automotive, renewable energy, aerospace, industrial control systems, and high-power electronics applications.