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12/10/2022

Aismalibar attending to Electronica nov22

Aismalibar says

ELECTRONICA

November 15-18, 2022
MESSE MÜNCHEN
Hall B1 Booth 543

ELECTRONICA

November 15-18, 2022
MESSE MÜNCHEN
Hall B1 Booth 543

Aismalibar to attend Electronica, on Novermber 15-18 at Munich, the world's leading event for electronics

Eletronic developments increasingly need to improve thermal dissipation and maintain good dielectric strength. Thermal management becomes more challenging on new PCBs design needs. At Aismalibar we have been developing industry-leading solutions to enhance the overall thermal performance of your electronic circuits.

Some "Tech-Bites" about the latest innovations:

Eduardo Benmayor

Eduardo Benmayor

General Manager

Uwe Lemke

Business Developer

José María Serrat

Sales Manager

Our experts explaining each innovative materials we have been developing to design high performance PCBs.

Find them at Hall B1 Booth 543.

COOLING ELECTRONICS

Our team will show you solutions to simplify your PCB designs improving circuits performance

Thermal dissipation in wide-bandgap power semiconductors (WBG)

We get 12% of temperature reduction using Aismalibar THIN LAM 3,2W (No thermal vias) vs Standar FR4 with Thermal Vias. Not using or reducing thermal vias facilitates PCB fabrication and design. A research collaboration with UPC Universitat Politècnica de Catalunya (TIEG Group).

Improve dielectric isolation and fast thermal transmission

Aismalibar’s new TIMs overcome the problems we find working with Thermal Pastes and Dielectric Thin Films. A clean, fast and efficient solution to solve interface in between MPCB / Power Components and heat sinks, minimizing air gaps to reduce thermal resistance.

Thermal Materials for Electric Vehicle Batteries

Our TIM (Thermal Interface Materials) and IMS (Insulated Metal Substrates) ranges improve dielectric isolation and fast thermal transmission in battery assemblies, taking into consideration cost reduction, lifetime performance, safety and reliability.

Excellent working temperature and thermal performance

With a thickness of only 35 microns, COBRITHERM ULTRATHIN High Tg reduces thermal resistance down to 0.11Kcm2/w (0,017 Kin2/W), offering excelent thermal dissipation conditions for high power LEDs assembly.

Download our Electronica 2022 Leaflets

COOLING ELECTRONICS

Learn how to remove heat from your PCB designs

AISMALIBAR'S FREE EBOOKS LIBRARY

Other news
11/07/2022

ELECTRONICA

November 15-18, 2022
MESSE MÜNCHEN
Hall B1 Booth 543

ELECTRONICA

November 15-18, 2022
MESSE MÜNCHEN
Hall B1 Booth 543

Aismalibar to attend Electronica, on Novermber 15-18 at Munich, the world's leading event for electronics

Eletronic developments increasingly need to improve thermal dissipation and maintain good dielectric strength. Thermal management becomes more challenging on new PCBs design needs. At Aismalibar we have been developing industry-leading solutions to enhance the overall thermal performance of your electronic circuits.

Some "Tech-Bites" about the latest innovations:

Eduardo Benmayor

Eduardo Benmayor

General Manager

Uwe Lemke

Business Developer

José María Serrat

Sales Manager

Our experts explaining each innovative materials we have been developing to design high performance PCBs.

Find them at Hall B1 Booth 543.

COOLING ELECTRONICS

Our team will show you solutions to simplify your PCB designs improving circuits performance

Thermal dissipation in wide-bandgap power semiconductors (WBG)

We get 12% of temperature reduction using Aismalibar THIN LAM 3,2W (No thermal vias) vs Standar FR4 with Thermal Vias. Not using or reducing thermal vias facilitates PCB fabrication and design. A research collaboration with UPC Universitat Politècnica de Catalunya (TIEG Group).

Improve dielectric isolation and fast thermal transmission

Aismalibar’s new TIMs overcome the problems we find working with Thermal Pastes and Dielectric Thin Films. A clean, fast and efficient solution to solve interface in between MPCB / Power Components and heat sinks, minimizing air gaps to reduce thermal resistance.

Thermal Materials for Electric Vehicle Batteries

Our TIM (Thermal Interface Materials) and IMS (Insulated Metal Substrates) ranges improve dielectric isolation and fast thermal transmission in battery assemblies, taking into consideration cost reduction, lifetime performance, safety and reliability.

Excellent working temperature and thermal performance

With a thickness of only 35 microns, COBRITHERM ULTRATHIN High Tg reduces thermal resistance down to 0.11Kcm2/w (0,017 Kin2/W), offering excelent thermal dissipation conditions for high power LEDs assembly.

Download our Electronica 2022 Leaflets

COOLING ELECTRONICS

Learn how to remove heat from your PCB designs

AISMALIBAR'S FREE EBOOKS LIBRARY

Other news

BOND SHEET CURED + AIR GAP FILLER

Ultra-thin dielectric layer, high dielectric strength,
high thermal conductivity and low thermal resistance.
Montaje_1

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)
50(1,2)

Air Gap Filler μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8)
80(3,1)
100(3,9)

Total thickness
Dielectric capacity
Thermal resistance Rth
Thermal conductivity
Bond Sheet Cured 70µm (ASTM 5476)
70 µm
4 KV
0,041 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 100µm (ASTM 5476)
100 µm
6 KV
0,058 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 70µm + Air Gap Filler
120 µm
4,2 KV
0,07 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 100µm + Air Gap Filler
150 µm
6,2 KV
0,088 K/W
2,2 W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 70µm + Air gap filler
170 µm
4,4 KV
0,099 K/W
2,2 W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 100µm + Air gap filler
200 µm
6,4 KV
0,117 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg (ASTM 5476)
80 µm
4 KV
0,031 K/W
3,2 W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg + Air gap filler
130 µm
4,2 KV
0,051 K/W
3,2 W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 80µm HTg + Air gap filler
180 µm
4,4 KV
0,070 K/W
3,2 W/mK
Technical data sheet
Dielectric capacity Dielectric capacity Thermal resistance Rth Thermal resistance Rth Thermal conductivity Thermal conductivity
Bond sheet cured 70µm (ASTM5476)
Total thickness
70µm
Dialectric capacity
4KV
Thermal resistance Rth
0,041K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Bond Sheet Cured 100µm (ASTM 5476)
Total thickness
100µm
Dialectric capacity
6KV
Thermal resistance Rth
0,058K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Bond Sheet Cured 70µm + Air gap filler
Total thickness
120µm
Dialectric capacity
4,2KV
Thermal resistance Rth
0,07K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Bond Sheet Cured 100µm + Air gap filler
Total thickness
150µm
Dialectric capacity
6,2KV
Thermal resistance Rth
0,88K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 70µm + Air gap filler
Total thickness
170µm
Dialectric capacity
4,4KV
Thermal resistance Rth
0,99K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 100µm + Air gap filler
Total thickness
200µm
Dialectric capacity
6,4KV
Thermal resistance Rth
0,117K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg (ASTM 5476)
Total thickness
80µm
Dialectric capacity
4KV
Thermal resistance Rth
0,031K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg + Air gap filler
Total thickness
130µm
Dialectric capacity
4,2KV
Thermal resistance Rth
0,051K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 80µm High Tg + Air gap filler
Total thickness
180µm
Dialectric capacity
4,4KV
Thermal resistance Rth
0,070K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Bond sheet cured 70µm (ASTM5476)
Total Thickness
70 µm
Dialectric capacity
4 KV
Thermal resistance Rth
0,041K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 100µm (ASTM5476)
Total Thickness
100 µm
Dialectric capacity
6 KV
Thermal resistance Rth
0,058 K/W
Thermal conductivity
2,2 W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 70µm + Air gap filler
Total Thickness
120 µm
Dialectric capacity
4,2 KV
Thermal resistance Rth
0,07 K/W
Thermal conductivity
2,2 W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 100µm + Air gap filler
Total Thickness
150 µm
Dialectric capacity
6,2 KV
Thermal resistance Rth
0,88 K/W
Thermal conductivity
2,2 W/mK
Technical data sheet
Technical data sheet
Air gap filler + Bond Sheet Cured 70µm + Air gap filler
Total Thickness
170 µm
Dialectric capacity
4,4 KV
Thermal resistance Rth
0,99 K/W
Thermal conductivity
3,2 W/mK
Technical data sheet
Technical data sheet
Air gap filler + Bond Sheet Cured 100µm + Air gap filler
Total Thickness
200 µm
Dialectric capacity
6,4 KV
Thermal resistance Rth
0,117 K/W
Thermal conductivity
3,2 W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 80µm High Tg (ASTM 5476)
Total Thickness
80 µm
Dialectric capacity
4 KV
Thermal resistance Rth
0,031 K/W
Thermal conductivity
3,2 W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 80µm High Tg + Air gap filler
Total Thickness
130 µm
Dialectric capacity
4,2 KV
Thermal resistance Rth
0,051 K/W
Thermal conductivity
3,2 W/mK
Technical data sheet
Technical data sheet
Air gap filler + Bond Sheet Cured 80µm High Tg + Air gap filler
Total Thickness
180 µm
Dialectric capacity
4,4 KV
Thermal resistance Rth
0,070 K/W
Thermal conductivity
3,2 W/mK
Technical data sheet
Technical data sheet

ALPRIMER (ISOLAL)

Aluminum laminate coated with a thermal conductive ultra-thin dielectric layer.

Imagen1

Insulation thickness µm (in)

100(3,9)

Aluminium thickness um (In)

1000 (0.039)/ 1500 (0.059)/2000(0.078)/3000 (0.12)

Dielectric capacity (KV)
ALP
6
Technical Data Sheet

BOND SHEET CURED + THERMAL TAPE

Adhesive film with thermal transmission combined with an ultra-thin dielectric layer.

Thermal Tape um (mllc)

50 (1.9)

Dielectric thickness µm (mlic)

70(2,8)/80(3,1) / 100(3,9)

Total Thickness (µm)
Dielectric capacity (KV)
Thermal Resistance Rth (K/W)
Thermal Conductivity
Bond Sheet Cured 70µm + Thermal Tape
120
4,5
0,09
2,2 W/mk
Technical Data Sheet
Bond Sheet Cured 100µm + Thermal Tape
150
6,5
0,107
2,2 W/mk
Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 70µm + Thermal Tape
170
4,7
0,119
2,2 W/mk
Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 100µm + Thermal Tape
200
6,7
0,136
2,2 W/mk
Technical Data Sheet
Bond Sheet Cured 80µm High Tg + Thermal Tape
130
4,5
0,08
3,2 W/mK
Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 80µm High Tg + Thermal Tape
180
4,7
0,099
3,2 W/mK
Technical Data Sheet